Expert pcb - Electronic CAO study office

  • PCB CAD process
  • design steps
  • ISO9000 Quality

EXPERT PCB : ELECTRONIC CAD SUBCONTRACTING

During electronic CAO subcontracting, we follow a rigorous process for the study and electronic routing of your card. At each key stage, our team of implanters validates the work with you: diagrams, placement, routing, DRC, adapted impedance and HDI, manufacturing and assembly file.

Phases of electronic CAO subcontracting

Based on your data and technical specifications, we will set up a rigorous and quality PCB CAD design process. Our electronic CAO stations allow us to import netlists from other CAD software such as: Altium Designer, Cadstar, Eagle, Cadence, Visula, Orcad, etc.

PCB design process

Kick Off

Formalization of the order by submitting your final specifications: diagrams, layers, BOM, routing rules, mechanical plans, design standard, etc. A checking of the input data is carried out. Updating of schemas is permitted. The technical inconsistencies are resolved.

Update Schéma

Analysis: inconsistencies, labels, power supplies, disconnection, etc …

PCB library creation

Pads specific to components not listed in the CAD editor database must, in some cases, be designed by our technicians. Editing your PCB in 3D format can also be one of your concerns.

Placement

Validation of the diagram and placement of components. This is a crucial step for routing. Care is taken to place the decoupling capacitors as close as possible to the power supplies.

Routing

Routing, rule initialization, stackup, CEM table, etc.
Isolation routing. Routing of critical tracks.
Ground plane routing.
Finishing and silkscreen printing.

MFG files

Creation of CAM files Gerbers, drill, mill, P & amp; P, etc …
Documentation.
Database, DFX, pdfs.
Standard file with plans and CD.

Electronic diagram - Expert PCB
Expert PCB Altium
PCB - CAD PCB Altium - EXPERT PCB
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ISO standards PCB classes and NF standards

Schéma percage en angalis

Classes on finished hole

ISO Class :

Criteria for belonging
to a class
Classes
1 2 3 4 5 6
Total thickness of
copper on the faces
external
105 105 105 70 50 35
Maximum thickness on
internal layers
105 105 70 35 35 17.5
Track width ≥ 0.80 0.79-0.50 .49-0.31 0.30-0.21 .20-0.15 0.14-0.12
Minimum width
isolation
≥ 0.68 0.67-0.50 0.49-0.31 0.30-0.21 0.20-0.15 0.14-0.12

Beyond these values, especially on tracks and insulation less than 120 μm, an analysis of the
file will be carried out in order to define the manufacturing methods.

Drilling class on finished hole

– Double-sided card

Criteria for belonging to
a class
Classes
1 2 3 4 5 6
Minimum difference of
diameter of a pellet and
a finished connection hole
≥0.60 0.59-0.49 0.48-0.39 0.38-0.35
Minimum difference of
diameter of a pellet and
a finished insertion hole
≥1.19 1.18-0.78 0.77-0.60 0.59-0.49 0.48-0.39 0.38-0.35

– Multilayer card:

Criteria for belonging to
a class
Classes
3 4 5 6
Minimum difference of
diameter of a pellet and a
finished connection hole
C≤300
300<C≤460
460<C≤600
≥0.68
≥0.73
≥0.78
0.67-0.58
0.72-0.63
0.77-0.68
0.57-0.47
0.62-0.52
0.67-0.57
0.46-0.44
0.51-0.49
0.56-0.54
Minimum difference of
diameter of a pellet and a
finished insertion hole
C≤300
300<C≤460
460<C≤600
≥0.68
≥0.73
≥0.78
0.67-0.58
0.72-0.63
0.77-0.68
0.57-0.47
0.62-0.52
0.67-0.57
0.46-0.44
0.51-0.49
0.56-0.54
Minimum difference of
diameter of a window and a
finished connection hole
C≤300
300<C≤460
460<C≤600
≥1.30
≥1.35
≥1.40
1.29-1.00
1.34-1.05
1.39-1.10
0.99-0.77
1.04-0.82
1.09-0.87
0.76-0.68
0.81-0.73
0.86-0.78
Minimum difference of
diameter of a window and a
finished insertion hole
C≤300
300<C≤460
460<C≤600
≥1.30
≥1.35
≥1.40
1.29-1.00
1.34-1.05
1.39-1.10
0.99-0.77
1.04-0.82
1.09-0.87
0.76-0.68
0.81-0.73
0.86-0.78

Note: “C” is the longest side of the map

Criteria for belonging to
a class
Classes
1 2 3 4 5 6
Total thickness of
copper on the faces
external
105 105 105 70 50 35
Maximum thickness on
internal layers
105 105 70 35 35 17.5
Track width ≥0.80 0.79-0.50 0.49-0.31 0.30-0.21 0.20-0.15 0.14-0.12
Minimum width
isolation
≥0.68 0.67-0.50 0.449-0.31 0.30-0.21 0.20-0.15 0.14-0.12

Drilling class on drilled hole

– Double sided card

Criteria for belonging to
a class
Classes
1 2 3 4 5 6
Minimum difference of
diameter of a pellet and
of a connection hole
pierced
≥0.45 0.44-0.34 0.33-0.24 0.23-0.20
Minimum difference of
diameter of a pellet and
an insertion hole
perforated
≥1.04 1.03-0.63 0.62-0.45 0.44-0.34 0.33-0.24 0.23-0.20

– Multilayer card:

Criteria for belonging to a class Classes
3 4 5 6
Minimum difference of
diameter of a pellet and a
connection hole drilled
C≤300
300<C≤460
460<C≤600
≥0.53
≥0.58
≥0.63
0.52-0.43
0.57-0.48
0.62-0.53
0.42-0.32
0.47-0.37
0.52-0.42
0.31-0.29
0.36-0.34
0.41-0.39
Minimum difference of
diameter of a pellet and a
drilled insertion hole
C≤300
300<C≤460
460<C≤600
≥0.53
≥0.58
≥0.63
0.52-0.43
0.57-0.48
0.62-0.53
0.42-0.32
0.47-0.37
0.52-0.42
0.31-0.29
0.36-0.34
0.41-0.39
Minimum difference of
diameter of a window and a
connection hole drilled
C≤300
300<C≤460
460<C≤600
≥1.15
≥1.20
≥1.25
1.14-0.85
1.19-0.90
1.24-0.95
0.84-0.62
0.89-0.67
0.94-0.72
0.61-0.53
0.66-0.58
0.71-0.63
Minimum difference of
diameter of a window and a
drilled insertion hole
C≤300
300<C≤460
460<C≤600
≥1.15
≥1.20
≥1.25
1.14-0.85
1.19-0.90
1.24-0.95
0.84-0.62
0.89-0.67
0.94-0.72
0.61-0.53
0.66-0.58
0.71-0.63

Note: “C” is the longest side of the map

Metallization

  1. Certifications cartes électronique - Recto
  2. Certifications cartes électronique - Verso
  • Electrolytic gold plating:Ep Nickel 5 μm, Ep, Or 0,1 à 5 μm
  • Chemical gilding: Ep Nickel 3 à 5 μm, Ep, Or 0,05 à 0,10 μm
  • Copper deposit: 30 à 35 μm maxi
  • Gold plating Connector and Rubbing contacts: Ep Nickel 3 à 7 μm , Or Cobalt 2 μm mini
  • Gilding on bare copper: 3 μm Mini

Nominal diameters and hole tolerances

Non-metallized holes for inserting components for cards with thickness ≤ 3.2 mm

Nominal diameters (D) mm Tolerances
From 0,8 to 1,35 ± 0,05 for D≤1,00
± 0,10 for D>1,00

Metallized holes for inserting components for cards with thickness ≤ 3.2 mm

Nominal diameters (D) mm Tolerances
From 0,7 to 2,00 + 0,1 / – 0,05
+0,15 / -0,1

Metallized holes intended for press fit connections, on card thickness 2.4 mm minimum

The tolerances are linked to the type of terminals used:
– Terminals D ou E => SnPb finished hole diameter before reflow : 1 mm + 0,09 / – 0,06
Terminals D => SnPb finished hole diameter before reflow : 1 mm + 0,05 / – 0,07

Any other configuration will require special analysis.

Via holes

The finished diameter of the vias holes is not tolerated except by customer specification.

Savings varnish

The circuits cannot be varnished in the automatic process if their thickness is less than or equal to 0.6 mm.

Testimonials

EXPERT PCB :
A team of expert implanters in electronic PCB CAO

+33 (0)4.28.61.78.43

99 CHEMIN DES HUGUENOTS - 26000 VALENCE

contact@expert-pcb.com